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Device IC damage influence in no device testing the module w

来源:学生作业帮 编辑:搜搜考试网作业帮 分类:英语作业 时间:2024/06/08 19:14:15
Device IC damage influence in no device testing the module was verified through de-processing analysis.no device was caused by device IC damage.
Device IC damage influence in no device testing the module w
通过过程分析可以确定集成电路的损坏不会对检测模块造成影响.装置也不会受集成电路的影响.
表达没有错误,就是那个词:deprocessing没怎么听过呢,不过不影响意思的理解